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 Home > HPCC > CTSF > PARAM Padma > Industrial Design and Packaging
Industrial Design and Packaging

The industrial design & packaging of PARAM Padma offers flexibility to scale from a system with a few nodes to systems having a large number of nodes. The PARAM Padma enclosure has been designed taking into consideration environmental requirements of high performance computing sub-assemblies. It is a 19 inch 38 U standard rack with shielded cable trays and accessories for housing Compute Nodes, File Servers, Network Switches and Cables.

 

 

 

 

 

 

 

 

 

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